{"product_id":"copper-aluminum-rotary-sputtering-target","title":"Copper Aluminum Rotary Sputtering Target","description":"\u003cp\u003eCopper Aluminum Rotary Sputtering Target is a source material for physical vapor deposition by sputtering. The Copper Aluminum Rotary identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. The tubular geometry should be matched to the rotary cathode and coating system. Basis Materials can discuss custom dimensions, purity requirements and bonding options during quotation, with the final configuration confirmed for the project.\u003c\/p\u003e","brand":"Basis Materials","offers":[{"title":"Default Title","offer_id":44400335585339,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0700\/9760\/0571\/files\/copper-aluminum-rotary-sputtering-target-basis-rebuilt.png?v=1791401996","url":"https:\/\/basismaterials.com\/products\/copper-aluminum-rotary-sputtering-target","provider":"Basis Materials","version":"1.0","type":"link"}