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Basis Materials representative image of Aluminum Antimonide Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Aluminum Antimonide Sputtering Target

Made to Order

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Overview

Aluminum Antimonide Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Aluminum Antimonide
Form Sputtering Target
CAS number 12041-89-3
Purity options ≥99%
Shape options Discs
Bonding options Indium
Density (reference) 4.26 g/cm³
Melting point (reference) 1060 °C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Request a product-specific SDS

Please request the SDS for your specific material and configuration.

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Tell us what you need

Aluminum Antimonide Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.