THIN FILM DEPOSITION
Precision bonding and backing-plate solutions for sputtering targets used in research and production deposition systems.
ASSEMBLY SERVICES
Basis Materials provides sputtering target bonding and backing-plate assembly services for metal, alloy, ceramic and compound targets. We review target material, geometry, backing-plate design, operating temperature, sputtering power and thermal-expansion behavior.
We support standard research targets as well as custom and production-scale assemblies. The bonding method, backing-plate material and assembly configuration are selected to match the customer's sputtering source and process requirements.
For your inquiry, distinguish the sputtering material from the complete assembly: specify whether you need a bare target, a target bonded to a backing plate, a separate backing plate, or a rotary target assembly. A product image does not confirm that a backing plate or bonding is included; the quoted configuration defines the supply scope.
01 / BONDING OPTIONS
Each method is reviewed against the material system and operating conditions.
Indium provides a conductive, compliant bond layer that can help accommodate expansion differences between a target and backing plate. It is used for many metal and ceramic targets in research and production systems.
A flexible interface can be useful for fragile or low-density targets, ceramic and compound materials, and assemblies with thermal-expansion mismatch. Suitability depends on the specific operating conditions.
Alternative metallic bonding materials can be selected for custom assemblies according to target, backing plate and service conditions. Options may include indium-based alloys and compatible silver-based systems.
For selected compatible material systems, a metallurgical bond may be possible without a conventional low-melting solder layer. This route requires engineering review of materials and process temperature.
02 / BACKING PLATES
We can supply complete bonded assemblies or evaluate customer-supplied targets and backing plates.
03 / ENGINEERING REVIEW
The optimum method depends on more than target material alone. We review the assembly and deposition conditions before recommending a configuration.
04 / QUALITY & INSPECTION
Consistent contact between target and backing plate supports heat transfer to the cathode cooling system. Inspection and documentation options are reviewed for each assembly and customer requirement.
Please specify the target, backing plate, and finished assembly separately. Include target-only thickness, plate thickness and mounting features, and the maximum assembled envelope defined by your cathode drawing.
Tell us whether you need new components or evaluation of a customer-supplied or previously used backing plate. Add the cathode model, intended power, cooling conditions, and any restrictions on bonding materials or interlayers.
Need help organizing the dimensions? See the bonded-target specification example.
Final dimensions, bonding method, inspection scope, and operating requirements are confirmed in the quotation.
START AN INQUIRY
Send your target material, dimensions, backing-plate drawing or sputtering-source information. We can review the assembly and recommend a bonding configuration.
Have a drawing? Email it to sales@basismaterials.com with the target material and your name.
Film mass estimation only. This tool does not determine target dimensions, target lifetime or bonding requirements.
