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Basis Materials representative image of Aluminum Tin Copper Planar Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Aluminum Tin Copper Planar Target

Made to Order

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Overview

Aluminum Tin Copper Planar Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Aluminum Tin Copper
Form Sputtering Target
Target configuration Planar
Purity options 99.9%
Shape options Planar Disc
Thickness 3 mm±0.5 mm (can be
Diameter 50 mm±1 mm (can be

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research
  • Electrodes and electrical contacts

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Request a product-specific SDS

Please request the SDS for your specific material and configuration.

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Tell us what you need

Aluminum Tin Copper Planar Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.