Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Aluminum Tin Copper Rotary Sputtering Target
Made to Order
Request a quoteSpecifications and availability are confirmed during quotation.
Need a Bonded Target?
We provide target bonding, custom backing plates and complete target assemblies for standard and custom sputtering systems.
For sputtered thin-film work, Aluminum Tin Copper Rotary Sputtering Target provides the named material in target form. The Aluminum Tin Copper Rotary identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. The tubular geometry should be matched to the rotary cathode and coating system. Ask Basis Materials about the required dimensions, purity and bonding arrangement; the finished target specification is established during quotation.
Technical specifications
| Material family | Metal Alloy |
|---|---|
| Constituent elements | Al, Sn, and Cu |
| Form | Sputtering Target |
| Shape | Tubular |
| Custom options available | true |
| Target configuration | Rotary |
| Availability | Made to Order |
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
Tell us what you need
Aluminum Tin Copper Rotary Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.