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Basis Materials representative image of Aluminum Tin Copper Rotary Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Aluminum Tin Copper Rotary Sputtering Target

Made to Order

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Specifications and availability are confirmed during quotation.

For sputtered thin-film work, Aluminum Tin Copper Rotary Sputtering Target provides the named material in target form. The Aluminum Tin Copper Rotary identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. The tubular geometry should be matched to the rotary cathode and coating system. Ask Basis Materials about the required dimensions, purity and bonding arrangement; the finished target specification is established during quotation.

Technical specifications

Material familyMetal Alloy
Constituent elementsAl, Sn, and Cu
FormSputtering Target
ShapeTubular
Custom options availabletrue
Target configurationRotary
AvailabilityMade to Order

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Aluminum Tin Copper Rotary Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.