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Basis Materials representative image of Barium Oxide Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Barium Oxide Sputtering Target

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Overview

Barium Oxide Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Barium Oxide
Form Sputtering Target
Formula option BaO
CAS number 1304-28-5
Purity options 99.5%
Shape options Discs, Plates, Column Targets, Step Targets
Deposition method (reference) RF, RF-R, DC
Bonding options Indium, Elastomer
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″
Melting point (reference) 1,923°C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Optical coatings
  • Sintered filter development

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Barium Oxide Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.