Skip to content
BASIS Materials Purity & Precision sales@basismaterials.com
REQUEST A QUOTE
Basis Materials representative image of Chromium Silicide Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Chromium Silicide Sputtering Target

Made to Order

Request a quote

Overview

Chromium Silicide Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Chromium Silicide
Form Sputtering Target
CAS number 12018-09-6
Shape options
  • Discs, Rectangle, Step, Plates, Sheets, Rods
  • Discs
Deposition method (reference) RF
Bonding options Indium, Elastomer
Purity options
  • 99.5%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 12 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 203.2 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Photovoltaic thin films

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

Request a Quote

Request a product-specific SDS

Please request the SDS for your specific material and configuration.

Request SDS
REQUEST A QUOTE

Tell us what you need

Chromium Silicide Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.