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Basis Materials representative image of Copper Aluminum Oxide (CuAlO2) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Copper Aluminum Oxide (CuAlO2) Sputtering Target

Grade / formula: CuAlO2

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Overview

Aluminum oxide is an electrically insulating ceramic. Copper Aluminum Oxide (CuAlO2) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Copper Aluminum Oxide (CuAlO2)
Formula / designation CuAlO2
Form Sputtering Target
CAS number 12250-93-0
Purity options ≥99%
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Bonding options Indium, Elastomer
Molar mass (formula reference) 122.526 g/mol
Density (reference) ≈6.0 g/cm³
Melting point (reference) ≈1230°C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Tell us what you need

Copper Aluminum Oxide (CuAlO2) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.