Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Copper Aluminum Rotary Sputtering Target
Made to Order
Request a quoteSpecifications and availability are confirmed during quotation.
Copper Aluminum Rotary Sputtering Target is a source material for physical vapor deposition by sputtering. The Copper Aluminum Rotary identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. The tubular geometry should be matched to the rotary cathode and coating system. Basis Materials can discuss custom dimensions, purity requirements and bonding options during quotation, with the final configuration confirmed for the project.
Technical specifications
| Material family | Metal Alloy |
|---|---|
| Constituent elements | Cu and Al |
| Form | Sputtering Target |
| Shape | Tubular |
| Custom options available | true |
| Target configuration | Rotary |
| Availability | Made to Order |
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
Tell us what you need
Copper Aluminum Rotary Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.