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Basis Materials representative image of Copper(I) Oxide Sputtering Targets

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Copper(I) Oxide Sputtering Targets

Made to Order

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Overview

Copper(I) Oxide Sputtering Targets is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Copper(I) Oxide
Form Sputtering Target
CAS number 1317-38-0
Shape options
  • Discs, Rectangle, Step, Plates, Sheets, Rods
  • Discs
Purity options
  • 99.7%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 11 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Optical coatings
  • Photovoltaic thin films
  • Catalysis research

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Copper(I) Oxide Sputtering Targets is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.