Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
BASIS MATERIALS / POWDER
Cu-Mn Copper Alloy Spherical Powder
Grade / formula: Cu-Mn
Made to Order
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Technical Specifications
| Material | Cu-Mn Copper Alloy |
|---|---|
| Formula / designation | Cu-Mn |
| Form | Spherical Powder |
| Density (reference) | ≈7.6g/cm³ |
| Melting point (reference) | 860-1020°C |
| Electrical resistivity (reference) | 200-250 µΩ·cm |
Powder Properties
| Particle morphology | Spherical |
|---|---|
| Particle-size options | 0.5–250 µm |
Final specifications, available configurations, pricing, and lead time are confirmed during quotation.
Applications
- Electrodes and electrical contacts
- Metal additive manufacturing development
Customization & RFQ
Requested grade or composition, particle-size interval, powder characterization requirements and quantity.
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