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Basis Materials representative image of Copper Nickel Titanium Rotary Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Copper Nickel Titanium Rotary Sputtering Target

Made to Order

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Specifications and availability are confirmed during quotation.

Copper Nickel Titanium Rotary Sputtering Target is a source material for physical vapor deposition by sputtering. The Copper Nickel Titanium Rotary identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. The tubular geometry should be matched to the rotary cathode and coating system. Basis Materials can discuss custom dimensions, purity requirements and bonding options during quotation, with the final configuration confirmed for the project.

Technical specifications

Material familyMetal Alloy
Constituent elementsCu, Ni, and Ti
FormSputtering Target
ShapeTubular
Custom options availabletrue
Target configurationRotary
AvailabilityMade to Order

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