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Basis Materials representative image of High Purity Copper Sputtering Target (5N)

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

High Purity Copper Sputtering Target (5N)

Grade / formula: 5N

Made to Order

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Overview

High Purity Copper Sputtering Target (5N) is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material High Purity Copper Sputtering Target
Formula / designation
  • 5N
  • Cu
Form Sputtering Target
CAS number 7440-50-8
Purity options 99.999%
Density (reference) 8.96 g/cm³ (at 20°C)
Melting point (reference) 1084.62 °C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

High Purity Copper Sputtering Target (5N) is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.