Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
BASIS MATERIALS / TARGET
High Purity Platinum Sputtering Target
Grade / formula: Pt
Made to Order
Request a quoteOverview
Technical Specifications
| Material | High Purity Platinum |
|---|---|
| Chemical symbol | Pt |
| Form | Sputtering Target |
| Deposition method (reference) | |
| Bonding options | |
| Purity options | |
| Size options |
View all 22 options |
| CAS number | 7440-06-4 |
| Shape options | Discs |
| Diameter | 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm |
| Thickness | 6.35 mm, 3.175 mm |
| Production process | Vacuum Melting + Precision Machining |
| Standard atomic weight (reference) | 195.08 ± 0.02 |
| Density (reference) | 21.5 g/cm³ |
| Melting point (reference) | 1768.2 °C |
| Thermal conductivity (reference) | 72 W/m.K |
Final specifications, available configurations, pricing, and lead time are confirmed during quotation.
Applications
- Semiconductor thin-film research
Customization & RFQ
Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
REQUEST A QUOTE
Tell us what you need
High Purity Platinum Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.