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Basis Materials representative image of Lithium Phosphate (Li3PO4) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Lithium Phosphate (Li3PO4) Sputtering Target

Grade / formula: Li3PO4

Made to Order

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Overview

Lithium Phosphate (Li3PO4) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Lithium Phosphate (Li3PO4)
Formula / designation Li3PO4
Form Sputtering Target
Purity options
  • 99.95%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 13 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 57mm Dia. x 2.54 mm Thick
  • 25.4 mm Dia x 3.175 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
  • 101.6 mm Dia x 3.175 mm Thick
CAS number 10377-52-3
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Deposition method (reference) RF, RF-R, DC
Bonding options Indium, Elastomer
Molar mass (formula reference) 115.79 g/mol
Density (reference) 2.53 g/cm³
Melting point (reference) ≈837°C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research
  • Photovoltaic thin films

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Tell us what you need

Lithium Phosphate (Li3PO4) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.