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Basis Materials representative image of Magnesium Silicide (Mg2Si) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Magnesium Silicide (Mg2Si) Sputtering Target

Grade / formula: Mg2Si

Made to Order

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Overview

Magnesium Silicide (Mg2Si) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Magnesium Silicide (Mg2Si)
Formula / designation Mg2Si
Form Sputtering Target
Purity options
  • 99.9%
  • 99.5%
  • ≥99%
Size options
  • 1.00” Dia. x 0.125” Thick
  • 2.00” Dia. x 0.125” Thick
  • 2.00” Dia. x 0.250” Thick
  • 3.00” Dia. x 0.125” Thick
View all 6 options
  • 4.00” Dia. x 0.125” Thick
  • 4.00” Dia. x 0.250” Thick
CAS number 22831-39-6
Shape options Discs
Deposition method (reference) RF, RF-R, DC
Bonding options Indium, Elastomer
Molar mass (formula reference) 76.695 g/mol
Density (reference) 1.99 g/cm³
Melting point (reference) 1100°C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Thermal-spray coating development

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Magnesium Silicide (Mg2Si) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.