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Basis Materials representative image of Planar Copper (Cu) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Planar Copper (Cu) Sputtering Target

Grade / formula: Cu

Made to Order

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Overview

Copper is valued for its electrical and thermal conductivity. Planar Copper (Cu) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Planar Copper (Cu)
Chemical symbol Cu
Form Sputtering Target
Target configuration Planar
Deposition method (reference) DC
Bonding options Indium, Elastomer
Purity options
  • 99.99%
  • 99.999%
  • 99.995%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 25 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 127 mm Dia. x 6.35 mm Thick
  • 54mm Dia. x 0.5mm Thick
  • 54mm Dia. x 1mm Thick
  • 57mm Dia. x 0.1mm Thick
  • 57mm Dia. x 0.2mm Thick
  • 57mm Dia. x 0.3mm Thick
  • 57mm Dia. x 0.5mm Thick
  • 57mm Dia. x 1mm Thick
  • 57mm Dia. x 2mm Thick
  • 57mm Dia. x 3mm Thick
  • 152.4 mm Dia. x 1.5875 mm Thick
  • 152.4 mm Dia. x 3.175 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 60mm Dia. x 2mm Thick
  • 60mm Dia. x 3mm Thick
  • 203.2 mm Dia. x 3.175 mm Thick
  • 203.2 mm Dia. x 6.35 mm Thick
CAS number 7440-50-8
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Standard atomic weight (reference) 63.546 ± 0.003
Density (reference) 8.96 g/cm³
Melting point (reference) 1084.62 °C
Thermal conductivity (reference) 400 W/m.K

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research
  • Photovoltaic thin films

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Planar Copper (Cu) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.