Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
BASIS MATERIALS / TARGET
Planar Copper (Cu) Sputtering Target
Grade / formula: Cu
Made to Order
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Technical Specifications
| Material | Planar Copper (Cu) |
|---|---|
| Chemical symbol | Cu |
| Form | Sputtering Target |
| Target configuration | Planar |
| Deposition method (reference) | DC |
| Bonding options | Indium, Elastomer |
| Purity options | |
| Size options |
View all 25 options |
| CAS number | 7440-50-8 |
| Shape options | Discs |
| Diameter | 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm |
| Thickness | 6.35 mm, 3.175 mm |
| Standard atomic weight (reference) | 63.546 ± 0.003 |
| Density (reference) | 8.96 g/cm³ |
| Melting point (reference) | 1084.62 °C |
| Thermal conductivity (reference) | 400 W/m.K |
Final specifications, available configurations, pricing, and lead time are confirmed during quotation.
Applications
- Semiconductor thin-film research
- Display thin-film research
- Photovoltaic thin films
Customization & RFQ
Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.
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Planar Copper (Cu) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.