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Basis Materials representative image of Rotatory Copper (Cu) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Rotatory Copper (Cu) Sputtering Target

Grade / formula: Cu

Made to Order

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Overview

Copper is valued for its electrical and thermal conductivity. Rotatory Copper (Cu) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Rotatory Copper (Cu)
Chemical symbol Cu
Form Sputtering Target
Target configuration Rotary
CAS number 7440-50-8
Purity options ≥99%
Shape options Rotatory
Standard atomic weight (reference) 63.546 ± 0.003
Density (reference) 8.96 g/cm³
Melting point (reference) 1084.62 °C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Optical coatings
  • Photovoltaic thin films

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Request a product-specific SDS

Please request the SDS for your specific material and configuration.

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Tell us what you need

Rotatory Copper (Cu) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.