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Basis Materials representative image of Silicon Nitride (Si3N4) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Silicon Nitride (Si3N4) Sputtering Target

Grade / formula: Si3N4

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Overview

Silicon Nitride (Si3N4) Sputtering Target is offered for thin-film deposition research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Silicon Nitride (Si3N4)
Formula / designation Si3N4
Form Sputtering Target
Deposition method (reference) RF, RF-R
Bonding options Indium, Elastomer
Purity options
  • 99.5%
  • 99.9%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 11 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
  • 101.6 mm Dia x 3.175 mm Thick
Molar mass (formula reference) 140.283 g/mol
Density (reference) 3.44 g/cm³
Melting point (reference) 1,900 °C

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Silicon Nitride (Si3N4) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.