Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Overview
Technical Specifications
| Material | Tin Silver |
|---|---|
| Form | Sputtering Target |
| Purity options | |
| Shape options | Discs, Plates |
| Deposition method (reference) | DC |
| Production process | Vacuum melting + precision machining |
| Bonding options | Indium (standard); copper backing plate optional |
| Thickness | 3.175 mm, 6.35 mm, or custom |
| Density (reference) | ≈7.4 g/cm³ (varies with composition) |
| Melting point (reference) | 221°C (eutectic Sn96.5/Ag3.5) |
| Electrical resistivity (reference) | ≈12 µΩ·cm |
Final specifications, available configurations, pricing, and lead time are confirmed during quotation.
Applications
- Semiconductor thin-film research
- Photovoltaic thin films
Customization & RFQ
Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
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Tell us what you need
Tin Silver Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.