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Representative image of Titanium Nickel (Ti/Ni) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Titanium Nickel (Ti/Ni) Sputtering Target

Grade / formula: Ti/Ni

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Specifications and availability are confirmed during quotation.

Titanium Nickel (Ti/Ni) Sputtering Target brings the specified material system into a sputtering source for thin-film deposition. The Ti/Ni identity helps define the film chemistry under a specified deposition process. Film chemistry and process compatibility should be reviewed for the intended coating. Source geometry and installation details are reviewed for the intended sputtering equipment. Size, purity and any backing or bonding requirement can be reviewed with Basis Materials before a target configuration is quoted.

Technical specifications

Material familyMetal Alloy
Material / GradeTi/Ni
Constituent elementsTi and Ni
FormSputtering Target
Custom options availabletrue
AvailabilityMade to Order

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Titanium Nickel (Ti/Ni) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.