Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Tungsten Sputtering Target
Grade / formula: W
Made to Order
Request a quoteSpecifications and availability are confirmed during quotation.
Need a Bonded Target?
We provide target bonding, custom backing plates and complete target assemblies for standard and custom sputtering systems.
Tungsten Sputtering Target brings the specified material system into a sputtering source for thin-film deposition. Tungsten is a refractory metal with a high melting point. It may be specified for high-temperature materials research and thin-film coating studies. Source geometry and installation details are reviewed for the intended sputtering equipment. Size, purity and any backing or bonding requirement can be reviewed with Basis Materials before a target configuration is quoted.
Technical specifications
| Material family | Pure Metal |
|---|---|
| Material / Grade | W |
| Element | W |
| Constituent elements | W |
| Form | Sputtering Target |
| Availability | Made to Order |
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Please request the SDS for your specific material and configuration.
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Tungsten Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.