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Basis Materials representative image of Bismuth Oxide (Bi2O3) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Bismuth Oxide (Bi2O3) Sputtering Target

Grade / formula: Bi2O3

Made to Order

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Overview

Bismuth Oxide (Bi2O3) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Material Bismuth Oxide (Bi2O3)
Formula / designation Bi2O3
Form Sputtering Target
Deposition method (reference) RF, RF-R
Bonding options Indium, Elastomer
Purity options
  • 99.9%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 9 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
CAS number 1304-76-3
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Molar mass (formula reference) 465.957 g/mol

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Display thin-film research
  • Optical coatings

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Please request the SDS for your specific material and configuration.

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Tell us what you need

Bismuth Oxide (Bi2O3) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.