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Basis Materials representative image of Gold (Au) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Gold (Au) Sputtering Target

Grade / formula: Au

Made to Order

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Overview

Gold is a conductive noble metal that resists oxidation. Gold (Au) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Gold (Au)
Chemical symbol Au
Form Sputtering Target
Purity options
  • 99.99%
  • 99.999%
  • ≥99%
Deposition method (reference) DC
Bonding options Indium, Elastomer
Size options
  • 377.825 mm x 120.65 mm x 6.35 mm Thick
  • 25.4 mm Dia. x 1.6002 mm Thick
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 0.1mm Thick
View all 49 options
  • 25.4 mm Dia. x 6.35 mm Thick
  • 25.4 mm Dia. x 1mm Thick
  • 25.4 mm Dia. x 2mm Thick
  • 425.958 mm x 121.158 mm x 1.5875 mm Thick
  • 50.8 mm Dia. x 0.9906 mm Thick
  • 50.8 mm Dia. x 1.6002 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 0.2mm Thick
  • 50.8 mm Dia. x 2mm Thick
  • 76.2 mm Dia. x 1.6002 mm Thick
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 76.2 mm Dia. x 0.2mm Thick
  • 76.2 mm Dia. x 2mm Thick
  • 101.6 mm Dia. x 0.9906 mm Thick
  • 101.6 mm Dia. x 1.6002 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 127 mm Dia. x 6.35 mm Thick
  • 54mm Dia. x 0.1mm Thick
  • 54mm Dia. x 0.2mm Thick
  • 54mm Dia. x 0.5mm Thick
  • 57mm Dia. x 1.5875 mm Thick
  • 57mm Dia. x 0.1mm Thick
  • 57mm Dia. x 0.2mm Thick
  • 57mm Dia. x 0.3mm Thick
  • 57mm Dia. x 0.5mm Thick
  • 57mm Dia. x 1mm Thick
  • 57mm Dia. x 2mm Thick
  • 152.4 mm Dia. x 1.6002 mm Thick
  • 152.4 mm Dia. x 3.175 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 60mm Dia. x 0.5mm Thick
  • 203.2 mm Dia. x 6.35 mm Thick
  • Upsilon, KDF, 374.142 mm Long, 4 Piece
  • Upsilon, KDF, 421.767 mm Long, 4 Piece
  • 25.4 mm Dia x 3.175 mm Thick
  • 50.8 mm Dia x 1.6002 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 50.8 mm Dia x 1.5875 mm Thick
  • 76.2 mm Dia x 1.6002 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 1.5875 mm Thick
  • 101.6 mm Dia x 3.175 mm Thick
CAS number 7440-57-5
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Standard atomic weight (reference) 196.97 ± 0.01
Density (reference) 19.3 g/cm³
Melting point (reference) 1064.18 °C
Thermal conductivity (reference) 320 W/m.K

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Optical coatings

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Request a product-specific SDS

Please request the SDS for your specific material and configuration.

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Tell us what you need

Gold (Au) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.