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Representative image of Platinum (Pt) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Platinum (Pt) Sputtering Target

Grade / formula: Pt

Made to Order

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Overview

Platinum is a noble metal valued for chemical stability. Platinum (Pt) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Platinum (Pt)
Chemical symbol Pt
Form Sputtering Target
Purity options
  • 99.99%
  • ≥99%
  • 99.95%
Deposition method (reference)
  • DC
  • DC, RF
Bonding options
  • Indium, Elastomer
  • Copper backing plate (Indium or Elastomer bonding available)
Size options
  • 25.4 mm Dia. x 1.6002 mm Thick
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 1.6002 mm Thick
View all 22 options
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
  • 76.2 mm Dia. x 1.6002 mm Thick
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 57mm Dia. x 0.1mm Thick
  • 57mm Dia. x 0.2mm Thick
  • 57mm Dia. x 0.3mm Thick
  • 57mm Dia. x 0.5mm Thick
  • 152.4 mm Dia. x 3.175 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 203.2 mm Dia. x 3.175 mm Thick
  • 203.2 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia x 3.175 mm Thick
  • 76.2 mm Dia x 3.175 mm Thick
  • Standard discs: 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm; Custom shapes available
CAS number 7440-06-4
Shape options Discs
Diameter 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm
Thickness 6.35 mm, 3.175 mm
Production process Vacuum Melting + Precision Machining
Standard atomic weight (reference) 195.08 ± 0.02
Density (reference) 21.5 g/cm³
Melting point (reference) 1768.2 °C
Thermal conductivity (reference) 72 W/m.K

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Request a product-specific SDS

Please request the SDS for your specific material and configuration.

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Tell us what you need

Platinum (Pt) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.