Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Tungsten (W) Sputtering Target
Grade / formula: W
Made to Order
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Tungsten is a refractory metal with a high melting point. Tungsten (W) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.
Technical Specifications
| Material | Tungsten (W) |
|---|---|
| Chemical symbol | W |
| Form | Sputtering Target |
| Deposition method (reference) | DC |
| Bonding options | Indium, Elastomer |
| Purity options | |
| Size options |
View all 14 options |
| CAS number | 7440-33-7 |
| Shape options | Discs |
| Diameter | 50.8 mm, 76.2 mm, 101.6 mm, 127 mm, 152.4 mm |
| Thickness | 6.35 mm, 3.175 mm |
| Standard atomic weight (reference) | 183.84 ± 0.01 |
| Density (reference) | 19.3 g/cm³ |
| Melting point (reference) | 3414 °C |
| Thermal conductivity (reference) | 174 W/m.K |
Final specifications, available configurations, pricing, and lead time are confirmed during quotation.
Applications
- Semiconductor thin-film research
Customization & RFQ
Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
Tell us what you need
Tungsten (W) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.