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Representative image of Molybdenum (Mo) Sputtering Target

Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.

BASIS MATERIALS / TARGET

Molybdenum (Mo) Sputtering Target

Grade / formula: Mo

Made to Order

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Overview

Molybdenum is a refractory metal used where thermal stability matters. Molybdenum (Mo) Sputtering Target is offered for semiconductor thin-film research. Specify the target configuration and dimensions required by your deposition system.

Technical Specifications

Technical specifications
Material Molybdenum (Mo)
Chemical symbol Mo
Form Sputtering Target
Deposition method (reference) DC
Bonding options Indium, Elastomer
Purity options
  • 99.95%
  • ≥99%
Size options
  • 25.4 mm Dia. x 3.175 mm Thick
  • 25.4 mm Dia. x 6.35 mm Thick
  • 50.8 mm Dia. x 3.175 mm Thick
  • 50.8 mm Dia. x 6.35 mm Thick
View all 14 options
  • 76.2 mm Dia. x 3.175 mm Thick
  • 76.2 mm Dia. x 6.35 mm Thick
  • 101.6 mm Dia. x 3.175 mm Thick
  • 101.6 mm Dia. x 6.35 mm Thick
  • 57mm Dia. x 0.25mm Thick
  • 152.4 mm Dia. x 3.175 mm Thick
  • 152.4 mm Dia. x 6.35 mm Thick
  • 203.2 mm Dia. x 3.175 mm Thick
  • 203.2 mm Dia. x 6.35 mm Thick
  • Dia.: 2″, 3″, 4″
Shape options Disc, Planar
Standard atomic weight (reference) 95.95 ± 0.01
Density (reference) 10.2 g/cm³
Melting point (reference) 2622 °C
Thermal conductivity (reference) 139 W/m.K

Final specifications, available configurations, pricing, and lead time are confirmed during quotation.

Applications

  • Semiconductor thin-film research
  • Photovoltaic thin films

Customization & RFQ

Requested purity, geometry, dimensions, composition where applicable, and backing / bonding configuration.

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Tell us what you need

Molybdenum (Mo) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.

For made-to-drawing assemblies, include the drawing number and revision in your notes and email the drawing to sales@basismaterials.com. Assembly suitability and the bonding method are reviewed for your material and equipment.