Representative image. Actual appearance may vary with composition, dimensions and manufacturing process.
Copper (Cu) Sputtering Target
Grade / formula: Cu
Made to Order
Request a quoteSpecifications and availability are confirmed during quotation.
Need a Bonded Target?
We provide target bonding, custom backing plates and complete target assemblies for standard and custom sputtering systems.
Copper (Cu) Sputtering Target is a source material for physical vapor deposition by sputtering. Copper is valued for its electrical and thermal conductivity. Common areas of inquiry include conductive films and electrical-material research. Planar geometry and mounting requirements depend on the deposition system. Basis Materials can discuss custom dimensions, purity requirements and bonding options during quotation, with the final configuration confirmed for the project.
Technical specifications
| Material family | Pure Element |
|---|---|
| Material / Grade | Cu |
| Element | Cu |
| Constituent elements | Cu |
| Form | Sputtering Target |
| Custom options available | true |
| Availability | Made to Order |
Request a product-specific SDS
Please request the SDS for your specific material and configuration.
Tell us what you need
Copper (Cu) Sputtering Target is included automatically. Tell us the form, size and quantity you need; other details are optional.